发明名称 MOUNTING COMPONENT, ELECTRONIC APPARATUS AND MOUNTING METHOD
摘要 <p>A mounting component has a pad, a leg portion having a bottom surface thereof soldered to the pad, and an auxiliary hole made in a side face of the leg portion. The auxiliary hole is laterally opened so as not to be opened to the bottom surface. The auxiliary hole is operable to receive melted solder therein.</p>
申请公布号 KR101278804(B1) 申请公布日期 2013.06.25
申请号 KR20110006612 申请日期 2011.01.24
申请人 发明人
分类号 H01L21/60;H01R13/24;H05K3/34 主分类号 H01L21/60
代理机构 代理人
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