| 摘要 |
PROBLEM TO BE SOLVED: To provide a coining device for minimizing the damage caused by a coining operation of a bump formed on one surface of a printed circuit board on a pad solder formed on the other surface of the printed circuit board. SOLUTION: A coining device comprises: a first jig 20 including a pressure block 21 for applying pressure on a bump 11 formed on one surface of a printed circuit board 10, and a projection part 22 formed to project in a pressure-applied direction so as to apply pressure to a region of the printed circuit board 10 other than a region where the bump 11 is formed; and a second jig 30 including an elastic member 40 formed in accordance with a pad solder 12 formed on the other surface of the printed circuit board 10. The present invention provides an effect of preventing the damage of the pad solder 12 formed on the other surface of the printed circuit board 10 in a process for coining the bump 11 formed on one surface of the printed circuit board 10 in an FC-BGA package. COPYRIGHT: (C)2012,JPO&INPIT |
