发明名称 |
LED package and method for making the same |
摘要 |
An LED package includes a substrate with two opposite lateral bulging portions, an LED die, an electrode structure, and a reflective layer. The substrate includes a first substrate and a second substrate stacked together; the first substrate and the second substrate are transparent; and the substrate includes an emitting surface for emitting light of the LED package. The electrode structure is sandwiched between the first substrate and the second substrate. The LED die is mounted in the substrate and electrically connected to the electrode structure. The reflective layer is formed on an outer surface of the substrate except the emitting surface and the bulging portions. The disclosure also provides a method for manufacturing such an LED package.
|
申请公布号 |
US8471287(B2) |
申请公布日期 |
2013.06.25 |
申请号 |
US201213370317 |
申请日期 |
2012.02.10 |
申请人 |
HU PI-CHIANG;HSU SHIH-YUAN;ADVANCED OPTOELECTRONICS TECHNOLOGY, INC. |
发明人 |
HU PI-CHIANG;HSU SHIH-YUAN |
分类号 |
H01L33/00 |
主分类号 |
H01L33/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|