| 摘要 |
<P>PROBLEM TO BE SOLVED: To suppress growth of whiskers from a lead-free plating layer and a lead-free solder formed on the surface of the terminal of an electronic component effectively and practically. <P>SOLUTION: In the electronic component including a terminal having at least one of a lead-free plating layer and a lead-free solder on the surface of a base material, at least the exposed surface of the lead-free plating layer and lead-free solder is covered with a coating layer containing a first material and a second material dispersed into the first material. A material which starts curing by contact with a third material different from any of the first and second materials is used as the second material. When the second material cures gradually, growth of whiskers from the lead-free plating layer and lead-free solder is suppressed by the second material, and growth of whiskers to the outside of the coating layer is avoided. <P>COPYRIGHT: (C)2013,JPO&INPIT |
