发明名称 PLASMA PROCESSING APPARATUS
摘要 <P>PROBLEM TO BE SOLVED: To perform stable and precise matching operation with high repeatability in a power modulation system for modulating a high frequency power supplied in a processing chamber into pulses. <P>SOLUTION: In the plasma processing apparatus, an impedance sensor 96A provided in a matching unit can harmonize the update rate of a load side impedance measurement value output from the impedance sensor 96A and the drive control speed of a motor in a matching controller, by performing double sampling average processing of the RF voltage measurement values and RF current measurement values obtained from an RF voltage detector 100A of a voltage sensor system and an RF current detector 108A of a current sensor system, by means of sampling average value arithmetic circuits 104A, 112A and moving average value arithmetic circuits 106A, 114A. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013125892(A) 申请公布日期 2013.06.24
申请号 JP20110274391 申请日期 2011.12.15
申请人 TOKYO ELECTRON LTD;DAIHEN CORP 发明人 YAMADA NORIKAZU;TACHIKAWA TOSHIFUMI;NAGAUMI KOICHI;HAMAISHI SATORU;ITAYA KOJI
分类号 H01L21/3065 主分类号 H01L21/3065
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