| 摘要 |
<P>PROBLEM TO BE SOLVED: To solve a problem that when heat resistance of a ceramic base material becomes small due to the reduction of an area in a heat dissipation wiring board having the ceramic base material for mounting heating elements, heat resistance of the entire heat dissipation wiring board becomes large resulting in insufficient improvement of heat radiation performance. <P>SOLUTION: A metal wiring pattern layer 2 is formed on a ceramic base material 1' having a small area. The ceramic base material 1' is bonded on a metal base material 4 having a large area. This structure allows heat generated by each LED element 3 to be transmitted to the rear surface side of the metal base material 4 through the metal wiring pattern layer 2 and the ceramic base material 1' and be radiated from a rear surface. Conductive rods 1a, made of a material, such as copper, which has heat conductivity higher than that of the ceramic base material 1', are embedded in the ceramic base material 1'. In this case, the conductive rod 1a is positioned immediately below each LED chip 3 and forms a columnar structure, such as a square column or a circular column, having a size equivalent to the LED chip 3. <P>COPYRIGHT: (C)2013,JPO&INPIT |
