发明名称 INJECTION MOLDING APPARATUS, AND INJECTION MOLDING METHOD
摘要 <P>PROBLEM TO BE SOLVED: To provide an injection molding apparatus and an injection molding method, by which a gas dissolved or mixed as bubbles in a molding material is sufficiently degassed and the molding material is densely filled into a flow path in the injection molding apparatus without wasting the molding material, and molding defects are prevented. <P>SOLUTION: The injection molding apparatus 1 is provided with: a storage and forcibly feeding portion 2 storing and forcibly feeding a liquid resin 11 of the molding material; and a measurement and injection portion 3 for measuring the liquid resin 11 forcibly fed from the storage and forcibly feeding portion 2 and injecting to a mold. The storage and forcibly feeding portion 2 is provided with: a tank 12 containing the liquid resin 11; and an intake and discharge port 25 for degassing and forcibly feeding the liquid resin 11. The tank 12 is installed in a higher position than any position of the resin flow path from a resin discharge port 43 provided in the bottom surface 42 of the tank 12 up to the discharge port 30 of a nozzle 34 provided in the measurement and injection portion 3. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013123896(A) 申请公布日期 2013.06.24
申请号 JP20110275580 申请日期 2011.12.16
申请人 MEIHO CO LTD 发明人 HAGA YOSHIKU;FUJII MAKOTO;HASE TETSUO
分类号 B29C45/00 主分类号 B29C45/00
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