| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a flexible printed wiring board which is superior in fine workability, low warpage, flexibility, and folding resistance, and also to provide a method of manufacturing the flexible printed wiring board. <P>SOLUTION: An insulating film on the same flexible printed wiring board includes a first place at least cured by exposure and patterned, and a second place cured by exposure in a low exposure amount as compared with the first place, but not patterned. The first place and the second place are obtained from the same photosensitive thermosetting resin. <P>COPYRIGHT: (C)2013,JPO&INPIT |
