发明名称 |
ELECTRONIC COMPONENT MOUNTING SUBSTRATE, LIGHT-EMITTING DEVICE AND DISPLAY DEVICE |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electronic component mounting substrate having a wiring pattern appropriate for power supply to multiple semiconductor elements provided on a linear substrate; and provide a light-emitting device having the electronic component mounting substrate and provide a display device. <P>SOLUTION: An electronic component mounting substrate includes a linear appearance, a first principal surface, a second principal surface on the side opposite to the first principal surface, and a first lateral face and a second lateral face in a longer direction. The first principal surface has terminals for mounting the electronic components. The first lateral face has wiring extending in the longer direction and electrically connected to the terminals. <P>COPYRIGHT: (C)2013,JPO&INPIT |
申请公布号 |
JP2013125869(A) |
申请公布日期 |
2013.06.24 |
申请号 |
JP20110273933 |
申请日期 |
2011.12.14 |
申请人 |
IBIDEN CO LTD |
发明人 |
TSUKADA KIYOTAKA;WAKIHARA YOSHINORI;NAGAYA NAOYUKI;TOMITA YOSHITOMO |
分类号 |
H01L23/12;F21S2/00;F21V19/00;F21Y101/02;H01L25/04;H01L25/18;H01L33/62 |
主分类号 |
H01L23/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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