| 摘要 |
Disclosed herein is a method of making a light emitting device comprising an LED and a molded silicon-containing encapsulant. The method includes contacting the LED with a photopolymerizable composition containing a silicon-containing resin having silicon-bonded hydrogen and aliphatic unsaturation and a metal-containing catalyst that may be activated by actinic radiation. Photopolymerization of the photopolymerizable composition is then carried out to form the encapsulant. At some point before polymerization is complete, a mold is used to impart a predetermined shape to the encapsulant. |
