| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a mold for manufacturing a high-quality semiconductor device. <P>SOLUTION: A mold used for manufacturing a semiconductor device includes one die pressing a workpiece from one surface side and another die pressing the workpiece from another surface side. At least one of the one die and the other die includes projections pressing the workpiece and a cavity formed so as to surround the projections. Between tips of the projections and the workpiece, a space is formed for trapping air exhausted from the cavity at the time of resin encapsulation. <P>COPYRIGHT: (C)2013,JPO&INPIT |
