发明名称 MANUFACTURING METHOD AND MANUFACTURING DEVICE OF POWER MODULE SUBSTRATE
摘要 <P>PROBLEM TO BE SOLVED: To certainly carry out positioning with a ceramic substrate even on a thin-wall metal plate. <P>SOLUTION: On a base plate 12, a supporting plate 13 and a corner positioning portion 17 for positioning one corner portion of a first metal plate 6 are raised. On the corner positioning portion, an inward reference surface disposed at a right angle so as to make the corner portion abut thereon is formed. The height of the inward reference surface is formed so as to be larger than the thickness of the supporting plate, and smaller than the laminated thickness of the supporting plate and the first metal plate. On a positioning jig, a corner reference receiving surface abutting on the supporting plate or the corner positioning portion to be positioned to the inward reference surface; a substrate positioning portion on which one corner portion of a ceramic substrate laminated on the first metal plate abuts; and a metal plate positioning portion on which one corner portion of a second metal plate laminated on the ceramic substrate abuts are formed. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013125908(A) 申请公布日期 2013.06.24
申请号 JP20110274972 申请日期 2011.12.15
申请人 MITSUBISHI MATERIALS CORP 发明人 NAGASE TOSHIYUKI;MIYATA HIROSHI
分类号 H01L23/12;H05K3/00;H05K3/38 主分类号 H01L23/12
代理机构 代理人
主权项
地址