| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a conductive adhesive capable of obtaining advantageous conduction relative to a substrate subjected to a preflux treatment, and to provide a connecting method for electronic parts. <P>SOLUTION: This conductive adhesive includes a polymerizable acryl-based compound, an organic peroxide, and solder particles, wherein the organic peroxide has a half-life temperature of one minute which is lower than the solidus temperature of the solder particles. In the connecting method using the adhesive, during the thermocompression bonding of the electronic parts, the solder particles are crushed; an oxide film is removed; and a preflux layer on the surface of a bump is removed by the melting and the flow of the solder particles. The conduction of the electronic parts is secured and then the adhesive component is completely cured. <P>COPYRIGHT: (C)2013,JPO&INPIT |
