发明名称 INJECTION MOLDING MOLD
摘要 <P>PROBLEM TO BE SOLVED: To provide an injection molding mold having superior thermal insulation performance to reduce a cycle time and having superior operability and productivity. <P>SOLUTION: Each of a pair of mold members is provided with: a cassette part in which a molding part is formed while being clamped; and a mold base having a base and a wall erected in the outer periphery of the base and housing the cassette part. When housed in the mold base, the cassette part is placed on the mold base through a thermal insulation member and is arranged to be opposed to the wall to form a gap between the cassette part and the mold base, a first temperature control means is arranged inside the cassette part and a second temperature control means is arranged in a base of the mold base and the inside of the thermal insulation member. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013123900(A) 申请公布日期 2013.06.24
申请号 JP20110275717 申请日期 2011.12.16
申请人 PANASONIC CORP 发明人 YOSHIDA HIROYUKI
分类号 B29C45/73 主分类号 B29C45/73
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