ADHESIVE, AND METHOD FOR CONNECTING ELECTRONIC COMPONENT

摘要

PROBLEM TO BE SOLVED: To provide an adhesive capable of obtaining excellent conduction with respect to a substrate subjected to pre-flux treatment and to provide a method for connecting an electronic component.

SOLUTION: The adhesive includes a (meth)acrylate having an epoxy group in one molecule, and a radical polymerization initiator having a one-minute half-life temperature of 110°C or higher. The imidazole component in pre-flux bonded to the epoxy group of an acrylate containing an epoxy group is pulled out of the terminal surface by the flow of extra adhesive component between terminals, so that the imidazole component is removed from the terminal surface.

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