| 摘要 |
PURPOSE: Sandpaper is provided to improve polishing efficiency by cutting an edge portion of a plurality of polishing protrusions being primarily touched in the planarization of semiconductor device. CONSTITUTION: Sandpaper comprises a base material(20) a plurality of polishing protrusion units(30). The plurality of polishing protrusion units is attached to the base material. Each polishing protrusion unit comprises a supporting layer(31) and a plurality of polishing protrusions(33). The supporting layer is attached to the base material. |
