| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a heat insulating material with superior heat resistance and having superior low thermal conductivity. <P>SOLUTION: The heat insulating material includes a foam having an open-cell structure having through holes between adjacent spherical bubbles. An average hole diameter of the spherical bubbles is smaller than 20 μm, and an average hole diameter of the through holes is 5 μm or smaller. In the heat insulating material, a coefficient of thermal conductivity measured according to ASTM-D5470 is 0.1 W/m*k or smaller when a compression rate is lower than 5%. <P>COPYRIGHT: (C)2013,JPO&INPIT |
