| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device in which an implant substrate and a semiconductor element of a semiconductor mounting substrate are joined and electrically connected with each other via implant pins and which can be manufactured with good productivity. <P>SOLUTION: In the semiconductor device, implant pins 20 are joined to a semiconductor element 8 and/or a circuit pattern 5 of a semiconductor mounting substrate via tubular terminals 10 into which other ends of the implant pins 20 are press-fitted, respectively. A press-fit depth L2 of the implant pin 20 into the tubular terminal 10 can be adjusted such that a total length of the press-fitted implant pin 20 and the tubular terminal 10 fits a distance between the semiconductor element 8 and/or the circuit pattern 5 of the semiconductor mounting substrate and an implant substrate 30. <P>COPYRIGHT: (C)2013,JPO&INPIT |
