| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a terminal connection structure which enables a solder fillet to properly be formed while improving local mismatch of impedance at a connection portion between a connection terminal and a surface electrode. <P>SOLUTION: A terminal connection structure includes: a surface electrode formed on a circuit board; an electronic component to which a signal is transmitted from the circuit board; and a connection terminal which has a connection part joined to a joint part of the surface electrode through a solder fillet and connects the electronic component with the surface electrode. The connection part has a notch part where a notch is formed at a position overlapping with the joint part, and the solder fillet is formed along an inner surface of the notch part. <P>COPYRIGHT: (C)2013,JPO&INPIT |
