摘要 |
PURPOSE: An air trap removing apparatus of a substrate is provided to spray plating liquid to the entire surface of a substrate and to easily remove air traps from the substrate. CONSTITUTION: A air trap removing apparatus of a substrate includes a introducing part(1a), a plating part(1b), a plating liquid spraying unit(10). A substrate is dipped in the introducing part. The plating part is connected to the introducing part and plates the dipped substrate. The plating liquid spraying unit is installed in the introducing part. The plating liquid spraying unit includes a main pipe, an auxiliary pipe, and a spraying nozzle. The main pipe is installed at the inner wall of the introducing part. The auxiliary pipe is connected to the main pipe. The spraying nozzle is attached to the auxiliary pipe and sprays plating liquid to the substrate. |