发明名称 ETCHING LIQUID FOR MULTI-LAYERED FILM INCLUDING COPPER AND MOLYBDENUM
摘要 <P>PROBLEM TO BE SOLVED: To provide an etching liquid for a multi-layered film containing copper and molybdenum, and an etching method for a multi-layered film containing copper and molybdenum using the etching liquid. <P>SOLUTION: The etching liquid for a multi-layered film containing copper and molybdenum is prepared by blending (A) an organic acid ion supply source having two or more carboxyl groups and one or more hydroxyl groups in the molecule, (B) a maleic acid ion supply source, (C) a copper ion supply source, and (D) ammonia and/or an ammonium ion supply source, and has a pH value of 5 to 8. An etching method using the etching liquid is also provided. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013124418(A) 申请公布日期 2013.06.24
申请号 JP20110275862 申请日期 2011.12.16
申请人 MITSUBISHI GAS CHEMICAL CO INC 发明人 TAMAI SATOSHI;YUBE KUNIO;OKABE SATORU
分类号 C23F1/14 主分类号 C23F1/14
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