| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electronic component capable of restraining warpage of a ceramic substrate. <P>SOLUTION: A ceramic substrate 10 is prepared, and a resin film 21 is provided on one face 10a of the ceramic substrate 10, and a via hole 22 penetrating in a thickness direction is formed on the resin film 21. An electronic component sequentially comprises: a first jointing member 20 filled with a first heat conductive member 23 in the via hole 22; and mounting components 30, 70 thermally connected to the ceramic substrate 10 via the first heat conductive member 23. Also, a resin film 41 same as the resin film 21 constituting the first joint member 20 is provided on the other face 10b of the ceramic substrate 10, and a via hole 42 penetrating in a thickness direction is formed on the resin film 41. The electronic component sequentially comprises: a second joint member 40 filled with a second heat conductive member 42 in the via hole 42; and a heat sink 50 thermally connected to the ceramic substrate 10 via the second heat conductive member 43. <P>COPYRIGHT: (C)2013,JPO&INPIT |
