| 摘要 |
<P>PROBLEM TO BE SOLVED: To achieve miniaturization of a device and reduction in facility cost in a cooling device for suppressing the temperature rise in a heating element. <P>SOLUTION: A tank 11 housing a heating element 10 therein is formed and the tank 11 is tightly sealed. The heating element 10 is supported in a fixed position in the tank 11 and a gap between the wall surface of the tank 11 and the outer surface of the heating element 10 is formed in a passage 13. An air flow area 15 where gas G flows is set in the same way as a liquid flow area 14 where liquid L flows in the passage 13 as a cooling medium, and the whole or a part of the heating element 10 is sunk in the liquid L of the liquid flow area 14. <P>COPYRIGHT: (C)2013,JPO&INPIT |
