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发明名称
封装体
摘要
提供一种组装时之作业性优异之封装体。;卷盘用封装体具备侧部(20)与侧部(30)。侧部(30)经由树脂成形体之弯折部位(51)从侧部(20)之端部竖立,与侧部(20)一起规定配置电容器之收容空间(50)。在侧部(20)形成从侧部(20)之表面(22a)凹陷之凹部(66)。在侧部(30)形成从侧部(30)之表面(32a)突出之凸部(61)。凸部(61)在以弯折部位(51)弯折树脂成形体时嵌合于凹部(66)。
申请公布号
TWI399328
申请公布日期
2013.06.21
申请号
TW099122129
申请日期
2010.07.06
申请人
村田制作所股份有限公司 日本;凸版印刷股份有限公司 日本
发明人
伊藤雄德;福田谦一;小林圣;牛尾畅成
分类号
B65D85/672
主分类号
B65D85/672
代理机构
代理人
阎启泰 台北市中山区长安东路2段112号9楼
主权项
地址
日本
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