MULTI-LAYER THIN FILM ASSEMBLY AND BARRIER FILM FOR ELECTRONIC DEVICE INCLUDING THE SAME

摘要

PURPOSE: Multi-layered thin film assembly can improve the performance of barriers by enhancing interlayer adhesion. CONSTITUTION: Multi-layered thin film assembly comprises a first layer including a first material with multiple sorts of functional groups, and a second layer including a second layer with a second material capable of interacting with at least two sorts of the functional groups of the multiple sorts of functional groups. The first layer and the second layer are laminated by turns. The second material interacts with at least two sorts of functional groups by electrostatic or chemical bonding force. The multiple sorts of functional groups are one-sided to either one of flat part or edge part of the inorganic layer compound. A barrier film for electric components comprises a multi-layered thin film assembly. The film thickness of the multi-layered thin film assembly is 50nm or less.