MOLDING APPARATUS FOR MANUFACTURING SEMI-CONDUCTOR PACKAGE

摘要

PURPOSE: A molding device for manufacturing a semiconductor package is provided to reduce accidents by controlling the thickness of molding resins without molding replacement. CONSTITUTION: A first molding(10) includes a storage space. A second molding(20) has a space part inside. A lift block is installed vertically in the space part. The lift block controls the height of a cavity. A plurality of filter members(30) function as a pillar and control a height.