发明名称 LIGHT EMITTING DIODE PACKAGE
摘要 PURPOSE: A light emitting device package is provided to improve heat dissipation by using a light guide in a side or a top viewer mode. CONSTITUTION: A light emitting chip(150) generates light. First and second lead frames(120a,120b) mount the light emitting chip. The first and second lead frames are bent at a predetermined angle. A light guide(160) surrounds the light emitting chip and the first and second lead frames. The light guide controls the direction of light generated in the light emitting chip.
申请公布号 KR20130067160(A) 申请公布日期 2013.06.21
申请号 KR20110134033 申请日期 2011.12.13
申请人 LG DISPLAY CO., LTD. 发明人 CHA, YOUNG HUN
分类号 H01L33/48 主分类号 H01L33/48
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