SEMICONDUCTOR PAKAGE AND METHOD FOR FABRICATING THE SAME

摘要

PURPOSE: A semiconductor package and a manufacturing method thereof are provided to prevent cracks by discharging air to the outside in reflow soldering. CONSTITUTION: A conductive layer and an insulating layer are alternatively laminated. A via hole(120a) selectively removes the insulating layer. The via hole exposes the conductive layer. A plating layer(120b) is connected to the conductive layer. A solder is formed on the plating layer.