| 摘要 |
A method of manufacture of an integrated circuit packaging system includes: forming a lead having a lead bottom body, a lead top body, and a lead top conductive layer directly on the lead top body, the lead top conductive layer having a top protrusion and a top non-vertical portion, the lead bottom body having a horizontally contiguous structure; connecting an integrated circuit to the top protrusion; and forming an encapsulation covering the integrated circuit and exposing a top non-vertical upper side of the top non-vertical portion.
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