发明名称 |
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH COUPLING FEATURES AND METHOD OF MANUFACTURE THEREOF |
摘要 |
A method of manufacture of an integrated circuit packaging system includes: providing a wafer substrate having an active side containing a contact; forming a through silicon via extending through the wafer substrate electrically connected to the contact having a via width; forming a first coupling feature extending from a top side of the through silicon via; and forming a second coupling feature on the side of the through silicon via opposite the first coupling feature. |
申请公布号 |
US2013154107(A1) |
申请公布日期 |
2013.06.20 |
申请号 |
US201113326116 |
申请日期 |
2011.12.14 |
申请人 |
KIM MINJUNG;CHOI DAESIK;KWON WONIL |
发明人 |
KIM MINJUNG;CHOI DAESIK;KWON WONIL |
分类号 |
H01L23/48;H01L21/768 |
主分类号 |
H01L23/48 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|