发明名称 |
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH TERMINALS AND METHOD OF MANUFACTURE THEREOF |
摘要 |
A method of manufacture of an integrated circuit packaging system includes: forming a lead having a lead top side; forming a lower interior conductive layer directly on the lead top side; forming an interior insulation layer directly on the lower interior conductive layer; forming an upper interior conductive layer directly on the interior insulation layer; and mounting an integrated circuit over the upper interior conductive layer.
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申请公布号 |
US2013154119(A1) |
申请公布日期 |
2013.06.20 |
申请号 |
US201113326806 |
申请日期 |
2011.12.15 |
申请人 |
DO BYUNG TAI;TRASPORTO ARNEL SENOSA;CHUA LINDA PEI EE |
发明人 |
DO BYUNG TAI;TRASPORTO ARNEL SENOSA;CHUA LINDA PEI EE |
分类号 |
H01L23/48;H01L21/50 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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