ELECTRICALLY CONDUCTIVE ADHESIVE AGENT, AND METHOD FOR CONNECTING ELECTRONIC COMPONENT

摘要

Provided are: an electrically conductive adhesive agent which can achieve good conduction in a substrate that has been treated with an organic solderability preservative; and a method for connecting an electronic component. An electrically conductive adhesive agent is used, which comprises a polymerizable acrylic compound, an organic peroxide and solder particles, wherein the one-minute half-life temperature of the organic peroxide is lower than the solidus line temperature of the solder particles. An oxide film is removed when the solder particles are crushed upon thermal compression bonding, an organic solderability preservative layer on the surface of a bump is removed upon the melting/fluidizing of the solder particles, and the adhesive agent component is hardened completely after the securement of the distribution of an electric power.