| 摘要 |
<p>A metal film (33) for bonding is formed on the upper surface of a base substrate (31), and a bonding material (34) is fixed to the upper surface of the metal film (33). A recessed section (38) is recessed into the lower surface of a cover substrate (35), and a metal film (37) for bonding is formed in the upper surface of the recessed section (38). The metal film (33) is formed such that the width (W1) thereof is narrower (Wr>W1) than the width (Wr) of the recessed section (38). The base substrate (31) and the cover substrate (35) are facing each other; the periphery of the recessed section (38) in the cover substrate (35) comes in contact with the upper surface of the base substrate (31); and the metal film (33) and the metal film (37) are eutectically bonded by the bonding material (34), inside the recessed section (38). The formula Vr>=V1+V2+V3 is fulfilled, when the volume of the metal film (33) is V1, the volume of the metal film (37) is V2, the volume of the bonding material (34) is V3, and the volume of the recessed section (38) is Vr.</p> |
