| 摘要 |
PURPOSE: A positive photosensitive resin composition for an electronic member, a curing film, and a display device are provided to improve the electronic characteristic and applicability of the composition by including a chain-structured aliphatic epoxy compound. CONSTITUTION: A positive photosensitive resin composition for an electronic member includes a polymer, a photoacid generator, and a chain-structured aliphatic epoxy compound. The polymer is either a polymer, which is obtained by copolymerizing a structure unit with a residual group protecting an acid group with an acid decomposable group and a structure unit with a cross-linking group, or a polymer with structure units which include a cross-linking group and a residual group protecting an acid group with an acid decomposable group. The molecular amount of the chain-structured aliphatic epoxy compound is 2000 or less. The viscosity of the chain-structured aliphatic epoxy compound at 25°C is 3000 mPa·s or less. The chain-structured aliphatic epoxy compound is represented by general formula X-1. In the general formula X-1, A is a linear or branched hydrocarbon group, possibly includes a hydroxyl group; and n is an integer from 1 to 4. |
