HEAT-DISSIPATING MODULE FOR ELECTRONIC COMPONENT, AND HEAT-DISSIPATING LIQUID USED THEREIN

摘要

The present invention relates to a heat-dissipating module for electronic components, and heat-dissipation dispersion insulating liquid used therein, the module including: a housing which has a liquid sealing structure; a substrate which is mounted with a heat-generating electronic component inserted into the housing; and heat-dissipation dispersion insulating liquid which is inserted into the housing and includes insulating liquid and heat-conductive particles to reduce the heat generated from the heat-generating electronic component.