发明名称 |
METHOD, STRUCTURE, AND DESIGN STRUCTURE FOR A THROUGH-SILICON-VIA WILKINSON POWER DIVIDER |
摘要 |
A method, structure, and design structure for a through-silicon-via Wilkinson power divider. A method includes: forming an input on a first side of a substrate; forming a first leg comprising a first through-silicon-via formed in the substrate, wherein the first leg electrically connects the input and a first output; forming a second leg comprising a second through-silicon-via formed in the substrate, wherein the second leg electrically connects the input and a second output, and forming a resistor electrically connected between the first output and the second output. |
申请公布号 |
US2013159957(A1) |
申请公布日期 |
2013.06.20 |
申请号 |
US201313763136 |
申请日期 |
2013.02.08 |
申请人 |
MACHINES CORPORATION INTERNATIONAL BUSINESS;INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
DING HANYI;JOSEPH ALVIN J.;WOODS, JR. WAYNE H. |
分类号 |
G06F17/50 |
主分类号 |
G06F17/50 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|