发明名称 THIN FILM CAPPING
摘要 The present invention relates to methods for sealing cavities in micro- electronic/-mechanical system (MEMS) devices to provide a controlled atmosphere within the sealed cavity. The method comprises providing a semiconductor substrate on which a template is provided on a localized area of the substrate. The template defines the interior shape of said cavity. Holes are made so as to enable venting of the cavity to provide a desired atmosphere to enter into the cavity through said hole. Finally, a sealing material is provided in the hole to seal the cavity. The sealing can be made by compression and/or melting of the sealing material.
申请公布号 WO2013089635(A1) 申请公布日期 2013.06.20
申请号 WO2012SE51402 申请日期 2012.12.17
申请人 SILEX MICROSYSTEMS AB 发明人 EBEFORS, THORBJOERN;SVEDIN, NIKLAS
分类号 B81C1/00 主分类号 B81C1/00
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