UNIVERSAL ENCAPSULATION SUBSTRATE, ENCAPSULATION STRUCTURE AND ENCAPSULATION METHOD

摘要

A universal encapsulation substrate (10), comprising a first substrate (102) and a silicon insertion layer (103); a plurality of projections (106) are formed between the upper surface of the first substrate and the bottom surface of the silicon insertion layer and electrically connect the same; a plurality of wiring bond pads are formed on the upper surface of the silicon insertion layer and are electrically connected to the plurality of projections respectively via silicon through holes (105). Also disclosed are an encapsulation structure provided with the encapsulating substrate and an encapsulation method. The substrate is suitable for small-batch integrated circuit products, providing low cost and short cycle for encapsulation.