发明名称 |
Solar Cell Flip Chip Package Structure and Method for Manufacturing the same |
摘要 |
The present invention provides a solar cell flip chip package structure, comprising: a substrate having a first surface, a second surface and an opening extending from the first surface to the second surface; a conducting layer disposed on the first surface of the substrate; a solar cell flip chip bonded on the conducting layer; a transparent layer attached on the second surface of the substrate; and a storage space formed between the opening extending from the first surface to the second surface, the solar cell flip chip and the transparent layer.
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申请公布号 |
US2013153016(A1) |
申请公布日期 |
2013.06.20 |
申请号 |
US201113330674 |
申请日期 |
2011.12.20 |
申请人 |
RU SHAO-PIN;TONG HSING ELECTRONIC INDUSTRIES, LTD. |
发明人 |
RU SHAO-PIN |
分类号 |
H01L31/0224;H01L31/02;H01L31/18 |
主分类号 |
H01L31/0224 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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