| 摘要 |
A method includes performing an etching step on a package. The package includes a package component, a connector on a top surface of the package component, a die bonded to the top surface of the package component, and a molding material molded over the top surface of the package component. The molding material covers the connector, wherein a portion of the molding material covering the connector is removed by the etching step, and the connector is exposed. |
