发明名称 |
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH SUBSTRATE MOLD GATE AND METHOD OF MANUFACTURE THEREOF |
摘要 |
A method of manufacture of an integrated circuit packaging system includes: providing a substrate; forming a mold gate on an upper surface of the substrate; mounting an integrated circuit to the substrate; and forming an encapsulant encapsulating the integrated circuit, the encapsulant having disruption patterns emanating from the mold gate and underneath a bottom plane of the integrated circuit. |
申请公布号 |
US2013154079(A1) |
申请公布日期 |
2013.06.20 |
申请号 |
US201113325395 |
申请日期 |
2011.12.14 |
申请人 |
KIM OH HAN;CHOI HAENGCHEOL;KIM KYUNGOE |
发明人 |
KIM OH HAN;CHOI HAENGCHEOL;KIM KYUNGOE |
分类号 |
H01L23/36;H01L21/56 |
主分类号 |
H01L23/36 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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