| 发明名称 |
METHOD OF FORMING A SEMICONDUCTOR DEVICE AND LEADFRAME THEREFOR |
| 摘要 |
In one embodiment, a leadframe for a semiconductor package includes a source connection area for one transistor and a drain connection point for a second transistor, and a common connection for using a connection clip to couple a drain of the first transistor to a source of the second transistor and to the common connection. |
| 申请公布号 |
US2013154073(A1) |
申请公布日期 |
2013.06.20 |
| 申请号 |
US201113327032 |
申请日期 |
2011.12.15 |
| 申请人 |
MASSIE HAROLD L.;CELAYA PHILLIP;MOELLER DAVID F.;RANDOL MARK |
发明人 |
MASSIE HAROLD L.;CELAYA PHILLIP;MOELLER DAVID F.;RANDOL MARK |
| 分类号 |
H01L23/495;H01L21/28;H01L21/50 |
主分类号 |
H01L23/495 |
| 代理机构 |
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代理人 |
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| 主权项 |
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