发明名称 COMBINATORIAL RF BIAS METHOD FOR PVD
摘要 <p>In some embodiments of the present invention, a shield is provided wherein the shield comprises a ceramic insulation material. The ceramic insulation material fills the space between the shield and the substrate surface and maintains a gap of less than about 2 mm and advantageously, less than about 1 mm. The shield may further be connected to ground through a low-pass filter operable to prevent the loss of high frequency RF power through the shield to ground but allow the dissipation of charge from the shield to ground through a low frequency or DC signal. In some embodiments, the ceramic insulating material further comprises a removable ceramic insert. The ceramic insert may be used to select the size of the aperture. The ceramic insert further comprises a slot operable to isolate the bottom lip of the ceramic insert from the upper portion for a PVD deposition.</p>
申请公布号 WO2013090001(A1) 申请公布日期 2013.06.20
申请号 WO2012US66532 申请日期 2012.11.26
申请人 INTERMOLECULAR, INC. 发明人 SHAO, SHOUQIAN;CHILD, KENT;TSUNG, JAMES;YANG, HONG SHENG
分类号 C23C16/04 主分类号 C23C16/04
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