发明名称 BONDING WIRE MANUFACTURING METHOD
摘要 <P>PROBLEM TO BE SOLVED: To provide a bonding wire manufacturing method which allows the improvement of the yield and workability of wire bonding by suppressing the falling of a coating layer off a core in a step of drawing a multilayer bonding wire. <P>SOLUTION: The method comprises a wire-drawing step where a coated wire 30 having a core 10 containing copper as a primary component and a coating layer 20 formed on the core to surround it is passed through a plurality of dies 60-67, and stepwise drawn and extended. If the reduction rate of the dies in the wire-drawing step is defined by the formula (1), the first die has a reduction rate between 5% and 10% inclusive, and the second and subsequent dies have a reduction rate between 5% and 15% inclusive. The reduction rate of the first die is set to be smaller than that of the second die. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013122971(A) 申请公布日期 2013.06.20
申请号 JP20110270442 申请日期 2011.12.09
申请人 NIPPON MICROMETAL CORP 发明人 SEIKE ATSUSHI
分类号 H01L21/60 主分类号 H01L21/60
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