| 发明名称 |
METHOD FOR PACKAGING SEMICONDUCTORS AT A WAFER LEVEL |
| 摘要 |
A package and method for packaging a semiconductor device formed in a surface portion of a semiconductor wafer. The package includes: a dielectric layer disposed on the surface portion of the semiconductor wafer having a device exposing opening to expose one of the devices and an electrical contacts pad opening to expose an electrical contact pad; and a porous material in the device exposing opening over said one of the devices.
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| 申请公布号 |
US2013154124(A1) |
申请公布日期 |
2013.06.20 |
| 申请号 |
US201113331408 |
申请日期 |
2011.12.20 |
| 申请人 |
HALLOCK ROBERT B.;DAVIS WILLIAM J.;ZHANG YIWEN;FILLMORE WARD G.;TRULLI SUSAN C.;MILNE JASON G.;RAYTHEON COMPANY |
发明人 |
HALLOCK ROBERT B.;DAVIS WILLIAM J.;ZHANG YIWEN;FILLMORE WARD G.;TRULLI SUSAN C.;MILNE JASON G. |
| 分类号 |
H01L23/48;H01L21/56 |
主分类号 |
H01L23/48 |
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