发明名称 INTEGRALLY MOLDED DIE AND BEZEL STRUCTURE FOR FINGERPRINT SENSORS AND THE LIKE
摘要 A biometric sensor device, such as a fingerprint sensor, comprises a substrate to which is mounted a die on which is formed a sensor array and at least one conductive bezel. The die and the bezel are encased in a unitary encapsulation structure to protect those elements from mechanical, electrical, and environmental damage, yet with a portion of the sensor array and the bezel exposed or at most thinly covered by the encapsulation or other coating material structure.
申请公布号 US2013154031(A1) 申请公布日期 2013.06.20
申请号 US201313767141 申请日期 2013.02.14
申请人 APPLE INC.;APPLE INC. 发明人 BOND ROBERT HENRY;KRAMER ALAN;GOZZINI GIOVANNI
分类号 H01L27/20 主分类号 H01L27/20
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