| 摘要 |
<p>The invention relates to a process for producing a printed circuit board comprising at least two elementary circuits (CE1, CE2) drilled with metallised holes (TCE1) the apertures of which are covered with a first metal and at least one first intermediate layer (Cl1) made of a compressible material drilled with holes (TC11) opposite elementary circuits (CE1, CE2) and the apertures of which are covered with a second metal, said first intermediate layer (Cl1) being placed between the two elementary circuits (CE1, CE2) and brazed to each of the circuits (CE1, CE2) by thermal diffusion of two metals forming an alloy at an alloy formation temperature (T). At least two second intermediate thermoplastic layers (CI2a, CI2b) having a melting point (Tf) above the alloy formation temperature (T) are provided between the first intermediate layer (Cl1) and said elementary circuits (CE1, CE2), these second layers not covering the first and second metal.</p> |
