发明名称 SURFACE TREATMENT APPARATUS, SURFACE TREATMENT METHOD, SUBSTRATE SUPPORTING MECHANISM, AND RECORDING MEDIUM
摘要 <p>Provided is a surface treatment apparatus for a substrate, which has: a substrate holder, which supports a substrate; a susceptor, which is rotated with a first straight line as a rotation axis, said first straight line orthogonally intersecting a plane parallel to a surface of the substrate to be treated, and which supports the substrate holder; and a susceptor rotating mechanism, which rotates the susceptor. The substrate holder rotates about the first straight line with rotation of the susceptor, and is capable of rotating with a second straight line as a rotation axis, said second straight line being a fixed straight line in a susceptor coordinate system fixed to the susceptor, and being parallel to the first straight line. The substrate holder is rotated when viewed from the susceptor coordinate system by changing the number of rotations of the susceptor per unit time.</p>
申请公布号 WO2013088706(A1) 申请公布日期 2013.06.20
申请号 WO2012JP07919 申请日期 2012.12.11
申请人 SUMITOMO CHEMICAL COMPANY, LIMITED 发明人 SAZAWA, HIROYUKI;ICHIKAWA, OSAMU;KURITA, YASUYUKI;YAMAMOTO, TAIKI
分类号 H01L21/205;C23C14/50;C23C16/458;H01L21/3065;H01L21/31 主分类号 H01L21/205
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