| 摘要 |
Disclosed is a polishing liquid for a semiconductor substrate, which contains polishing particles, 1,2,4-triazole and a basic compound. The basic compound is a nitrogen-containing basic compound or an inorganic basic compound, and is contained in the polishing liquid in an amount of not less than 0.1% by mass. The basic compound has a pH of not less than 9 but not more than 12. |
