发明名称 PRESSURE-SENSITIVE ADHESIVE COMPOSITION AND SURFACE PROTECTING FILM
摘要 <P>PROBLEM TO BE SOLVED: To provide a pressure-sensitive adhesive composition that enables the production of a surface protecting film in which adhesion is controlled even under environment of an extreme high temperature while securing a suitable initial adhesion power. <P>SOLUTION: The pressure-sensitive adhesive composition includes: a copolymer (I) or a hydrogenation body thereof having a structure shown by general formula: [A-B]n, wherein A denotes a given polymer block A mainly consisting of an aromatic alkenyl compound unit, B denotes a given random copolymer block polymer of an aromatic alkenyl-a conjugated diene, and n denotes an integer 1-3; and a copolymer (II) or a hydrogenation body thereof having a structure shown by general formula: A-B-A or general formula [A-B]x-Y, wherein x denotes an integer of one or more, and Y denotes a coupling agent residue. The pressure-sensitive adhesive composition further includes 0.3-2 pts.wt. of at least one fatty acid amide compound that has an endothermic peak originated from a fatty acid amide compound or a fatty acid amide composition that contains the fatty acid amide compound as a principal ingredient in a range of 40-80&deg;C by a differential scanning calorimetry or a fatty acid amide composition that contains the fatty acid amide compound as a principal ingredient, based on 100 pts.wt. of the total weight of the copolymers and the hydrogenation bodies. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013121989(A) 申请公布日期 2013.06.20
申请号 JP20110266335 申请日期 2011.12.05
申请人 SEKISUI CHEM CO LTD 发明人 FUKUMOTO YUICHIRO;TOYOSHIMA KATSUNORI
分类号 C09J153/02;C09J7/02;C09J11/06 主分类号 C09J153/02
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